2023年12月20日 — Learn about chip scale packages: types, ball pitch, wafer-level packaging, and interposer use in efficient, compact IC packaging technology.
Originally, the acronym “CSP” used to stand for “Chip Scale Package,” but since only a few packages are chip-sized, the acronym's meaning was adapted to Chip ...
These are called chip-scale packages (CSP) and are defined as packages that are no larger than 1.5 times the area of the die or no more than 1.2 times the width ...
A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Top and bottom of a WL-CSP package sitting on the face of a U.S. ...
Since the introduction of Chip Scale Packages (CSP's) only a few short years ago, they have become one of the biggest packaging trends in recent history. There ...
2022年4月13日 — A Chip Scale Package (CSP) is a type of integrated circuit (IC) package that is surface mountable and has an area not more than 1.2 times ...